Fig. 1: The introduction of ductile p-type AgCu(Te, Se, S) alloys.
From: Strategic vacancy engineering advances record-high ductile AgCu(Te, Se, S) thermoelectrics
a Schematic diagram of the microstructural characteristics of the as-prepared material (AgCu)0.998Te0.8Se0.1S0.1. b Engineering stress-strain curves for three-point bending tests for pristine AgCuTe and (AgCu)1−xTe0.9−ySe0.1Sy (x = 0, 0.002 and y = 0, 0.05, 0.08, 0.10, 0.12, 0.15, and 0.20) at room temperature. c Optical images of the (AgCu)0.998Te0.8Se0.1S0.1 materials with a thickness of 0.3 mm, showing good flexibility. d Figure of merit (ZT) and Seebeck coefficients (S) for this work compared with the reported works on ductile inorganic25,26,27,28,29,37,38,39,44,45,46,47,48,53, organic49,50,51,52, and typical Bi2Te3-based thermoelectrics42,43.
