Fig. 6: Mechanical properties and in-plane flexible thermoelectric devices (F-TEDs) based on AgCu(Te, Se, S) alloys. | Nature Communications

Fig. 6: Mechanical properties and in-plane flexible thermoelectric devices (F-TEDs) based on AgCu(Te, Se, S) alloys.

From: Strategic vacancy engineering advances record-high ductile AgCu(Te, Se, S) thermoelectrics

Fig. 6: Mechanical properties and in-plane flexible thermoelectric devices (F-TEDs) based on AgCu(Te, Se, S) alloys.

a Engineering stress-strain curves for three-point bending tests for pristine AgCuTe, Se-doped sample, (Se, S)-doped sample and further vacancy-introduced sample. Fracture surface morphologies of (AgCu)0.998Te0.8Se0.1S0.1 after b bending test and c compression test. (d) Fabricated in-plane F-TEDs based on (AgCu)0.998Te0.8Se0.1S0.1 with its schematics at the top. e, f Measured voltages (V) and output powers (P) of the device as a function of loading current (Iload) at different temperature differences (ΔTs). g The measurement output power density (ω) varies with ΔT. h Optical image of the in-plane F-TED adhered to a human arm. i Variation of measured open-circuit voltage (Voc) over time for the in-plane F-TED adhered to the human arm under static state, moving and static state with alcohol sprayed at the bottom of the device.

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