Fig. 1: Calculated performance of the Mg3Bi2 alloys/(Bi, Sb)2Te3-based thermoelectric cooler.
From: Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management
a The relationship between the maximum cooling temperature difference and the leg length at different electrical contact resistivities. b Maximum cooling power density vs. leg length at different contact resistivities. c The relationship between the maximum cooling temperature difference and the leg length with different substrate materials. d The relationship between the temperature of the hot-side ceramic substrate and the leg length.
