Fig. 2: The design of n-type Mg3.2Bi1.497Sb0.5Te0.003 thermoelectric leg. | Nature Communications

Fig. 2: The design of n-type Mg3.2Bi1.497Sb0.5Te0.003 thermoelectric leg.

From: Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management

Fig. 2: The design of n-type Mg3.2Bi1.497Sb0.5Te0.003 thermoelectric leg.The alternative text for this image may have been generated using AI.

a Schematic view of the leg structure, including pre-circuited AlN ceramic plate, Cu electrode, Sn42Bi58 solder, sputtered Cu layer, Mg2Ni contact layer, and Mg3Bi2-based materials. b Simulated maximum temperature difference as a function of the cross-section area ratio of the n- and p-type legs (An/Ap) with different contact layer thicknesses. c Simulated maximum temperature difference as a function of the leg lengths with different contact layer thicknesses. d Scanning electron microscopy image of the Mg3.2Bi1.497Sb0.5Te0.003/Mg2Ni/Cu film/Sn-Bi solder/Cu electrode junction, the corresponding EDX mapping, and the interfacial electrical contact resistance.

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