Fig. 1: Conceptual illustration of the TEIW.
From: Up-and-down transformable embedded ink writing strategy for soft 3D architectures
a Schematic illustration of the TEIW platform. b Rheological comparison between (i) CEIW and (ii) TEIW, including the comparison of storage modulus (G’) and loss modulus (G”), with their relative position evolvement influenced by gravitational force (Fg) and buoyant force (Fb). c Dynamic 2D-to-3D self-assembly driven by buoyancy-gravity interplay, where the moving distance is controlled by the volumetric flow rates. d Printing modalities enabled by TEIW: (i) freestanding structures via bath removal, (ii) integral structures through co-curing, (iii) hollow architectures using sacrificial inks, (ⅳ) hybrid printing of multi-materials via sequential steps.
