Fig. 6: Multi-functional 3D architectures via TEIW.
From: Up-and-down transformable embedded ink writing strategy for soft 3D architectures
a Resistive response of the embedded conductive circuitry under 0–500 g compressive loads. b Heterogeneous integration of a 3D channel and a helical circuit. c Validation of 3D channels via dyed fluid perfusion. d Embedded helical wires powering a green LED. e–g A stimuli-responsive encryption system. e Infrared thermography of the thermochromic elastomer during heating (25–75 °C). f Optical transparency changes of the thermochromic layer. g Visualization of fluorescent pattern under UV light. Scale bar: 1 cm.
