Fig. 3: High-speed ultraflexible NIR-OPD.

a Image of the ultraflexible OPD under tensile (compressive) strain. b Confocal microscopy and c scanning electron microscopy images of the device under 100% strain. d–f Device performance comparison before and after peeling from the supporting glass substrate. d J–V characteristics under NIR illumination (solid line) and dark (dashed line), e spectral EQE (solid line) and responsivity (dashed line), and f specific detectivity D*. g Decay profile of the charge current after turn-off of the irradiation light. Inset graph shows the dependence of the number of RCs on the carrier mobility. h VOC and JSC variations with tensile strain variations. i Transient response characteristics under varying tensile strain from 0 to 200%. Inset shows the measured rise (τr) and fall (τf) times with different tensile strain. j Mechanical durability test under repeated 33% compressive strain for 1000 cycles.