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Atomically sharp heteroepitaxial Hf2C edge contacts enabling barrier-free carrier injection in 2D HfSe2 semiconducting channels
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  • Published: 10 March 2026

Atomically sharp heteroepitaxial Hf2C edge contacts enabling barrier-free carrier injection in 2D HfSe2 semiconducting channels

  • Gihyeon Bhin1,2 na1,
  • Taeho Kang1,2 na1,
  • Jeong Won Jin3,
  • Sangmin Ji1,2,
  • Seung Yong Lee1,2,
  • Chang Yong Park1,2,
  • Ji Hwan Lee4,
  • Saeroonter Oh  ORCID: orcid.org/0000-0003-4281-68795,
  • Ji-Sang Park  ORCID: orcid.org/0000-0002-1374-87931,2,6,
  • Young Jae Song  ORCID: orcid.org/0000-0001-6172-38171,2,6,7,8 &
  • …
  • Sungjoo Lee  ORCID: orcid.org/0000-0003-1284-35931,2,6 

Nature Communications , Article number:  (2026) Cite this article

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We are providing an unedited version of this manuscript to give early access to its findings. Before final publication, the manuscript will undergo further editing. Please note there may be errors present which affect the content, and all legal disclaimers apply.

Subjects

  • Electrical and electronic engineering
  • Electronic devices

Abstract

Achieving high-quality source/drain contacts in two-dimensional (2D) semiconductors remains challenging due to Fermi-level pinning induced by metal-induced gap states (MIGS). Here, we demonstrate an atomically sharp Hf2C/HfSe2 edge contact formed via a laterally directed chemical conversion, driven by catalyst-assisted hydrodeselenization and carbonization under epitaxial alignment. Classical and ab initio molecular dynamics elucidate the atomistic mechanism of heteroepitaxial interface formation. Scanning tunneling microscopy and spectroscopy measurements confirm suppressed MIGS at the heteroepitaxial interface, indicating an electronically transparent junction. Electrical measurements reveal a near-zero Schottky barrier height ( ≈ 5 meV) and reduced contact resistance ( ≈ 475 Ω·μm) when compared with previously reported 2D edge-contact systems. When co-integrated with a van der Waals-integrated native high-κ HfO2 gate dielectric within a single HfSe2 channel, the devices exhibit a subthreshold swing of 62 mV/dec and on-state current density of 920 μA/μm. This integrated platform establishes a scalable design framework that couples contact and gate-stack engineering for next-generation 2D logic technologies.

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Data availability

Data supporting the findings of this work are provided in the paper and/or the Supplementary Information. Other relevant data can be obtained from the corresponding authors upon request.

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Acknowledgements

This research was supported by the Basic Science Research Program through the National Research Foundation of Korea and was funded by the Korean Government (MSIP) (Grant Nos. RS-2023-00281048 and RS-2025-00512822). This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-MA2501-01. This study was supported by Samsung Electronics Co. Ltd (IO251217-14774-01).

Author information

Author notes
  1. These authors contributed equally: Gihyeon Bhin, Taeho Kang.

Authors and Affiliations

  1. SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, South Korea

    Gihyeon Bhin, Taeho Kang, Sangmin Ji, Seung Yong Lee, Chang Yong Park, Ji-Sang Park, Young Jae Song & Sungjoo Lee

  2. Department of Nano Science and Technology, Sungkyunkwan University, Suwon, South Korea

    Gihyeon Bhin, Taeho Kang, Sangmin Ji, Seung Yong Lee, Chang Yong Park, Ji-Sang Park, Young Jae Song & Sungjoo Lee

  3. Department of Energy Science, Sungkyunkwan University, Suwon, South Korea

    Jeong Won Jin

  4. Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea

    Ji Hwan Lee

  5. Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon, South Korea

    Saeroonter Oh

  6. Department of Nano Engineering, Sungkyunkwan University, Suwon, South Korea

    Ji-Sang Park, Young Jae Song & Sungjoo Lee

  7. Center for 2D Quantum Heterostructures, Institute for Basic Science (IBS), Suwon, South Korea

    Young Jae Song

  8. Department of Physics, Sungkyunkwan University, Suwon, South Korea

    Young Jae Song

Authors
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Contributions

G.B. and T.K. conceived and designed the experiments. G.B. and T.K. prepared the materials, characterized the samples, fabricated the devices, and performed the electrical characterization with assistance from S.Y.L. and C.Y.P. J.-S.P. performed the first principles and ab initio molecular dynamics simulations and contributed to the mechanistic interpretation of the interface reactions. J.W.J. conducted the STM/STS analysis, and S.J. carried out the KPFM measurements. Y.J.S. supervised the STM/STS and KPFM analyses. S.O. and J.H.L. performed the device simulations and assisted in analyzing the electrical characteristics. S.L., G.B., and T.K. analyzed the data and co-wrote the manuscript with input from all authors. S.L. supervised the overall project.

Corresponding authors

Correspondence to Ji-Sang Park, Young Jae Song or Sungjoo Lee.

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Bhin, G., Kang, T., Jin, J.W. et al. Atomically sharp heteroepitaxial Hf2C edge contacts enabling barrier-free carrier injection in 2D HfSe2 semiconducting channels. Nat Commun (2026). https://doi.org/10.1038/s41467-026-70108-9

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  • Received: 19 November 2025

  • Accepted: 18 February 2026

  • Published: 10 March 2026

  • DOI: https://doi.org/10.1038/s41467-026-70108-9

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