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Potential well engineering for self-adaptive dielectric response polymer dielectrics
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  • Published: 26 March 2026

Potential well engineering for self-adaptive dielectric response polymer dielectrics

  • Daoming Zhang1 na1,
  • Qingyu Wang1 na1,
  • Congzhen Xie1,
  • An Zhong1,
  • Chunhui Bi1,
  • Yongxia Han  ORCID: orcid.org/0000-0001-8129-25401 &
  • …
  • Rui Wang  ORCID: orcid.org/0000-0002-8317-91271 

Nature Communications , Article number:  (2026) Cite this article

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We are providing an unedited version of this manuscript to give early access to its findings. Before final publication, the manuscript will undergo further editing. Please note there may be errors present which affect the content, and all legal disclaimers apply.

Subjects

  • Electrical and electronic engineering
  • Electronic devices

Abstract

The existing polymer dielectrics as insulating packaging media can no longer meet the insulation demands in highly integrated power electronic devices. Self-adaptive dielectrics with nonlinear dielectric response have been explored to eliminate electric field distortion caused by charge accumulation, but traditional strategies based on Schottky barriers result in interface defects. Here, we report polymer dielectric composites with customizable potential wells in recycled melamine foam-derived graphitic carbon nitride frameworks that overcome concerns about interface defects. We demonstrate that potential wells can efficiently capture low-energy charge carriers and release them for rapid transport under high electric fields. Notably, by doping donor or acceptor states into the frameworks, precise control over potential well depth and distribution was achieved, allowing customization of both nonlinear conductivity and threshold electric field strength. This work establishes a generalizable strategy for engineering next-generation self-adaptive dielectrics, enabling intelligent insulation behavior and enhanced reliability in high-field, high-temperature electronic packaging environments.

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Data availability

The data that support the findings of this study are available in the Source Data file. Source data are provided with this paper. Optimized atomic structures used for the DFT calculations are provided as Supplementary Data 1.  Source data are provided with this paper.

Code availability

No custom code was used or generated in this study. DFT calculations and finite-element simulations were performed using VASP and COMSOL Multiphysics.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (grant no. 52307025; R.W.) and the 2024 IEEE Dielectrics and Electrical Insulation Society (DEIS) Graduate Fellowship (D.M.Z.).

Author information

Author notes
  1. These authors contributed equally: Daoming Zhang, Qingyu Wang.

Authors and Affiliations

  1. School of Electric Power Engineering, South China University of Technology, Guangzhou, China

    Daoming Zhang, Qingyu Wang, Congzhen Xie, An Zhong, Chunhui Bi, Yongxia Han & Rui Wang

Authors
  1. Daoming Zhang
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  2. Qingyu Wang
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  3. Congzhen Xie
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Contributions

R.W. conceived the idea. R.W., D.M.Z. and Q.Y.W. designed the experiments. D.M.Z., Q.Y.W., A.Z. and C.H.B. carried out the experiments. Q.Y.W. and C.H.B. performed the simulations. R.W., C.Z.X., Y.X.H. and D.M.Z. analyzed the data. R.W. and D.M.Z. wrote the manuscript. All authors discussed the results and commented on the manuscript.

Corresponding authors

Correspondence to Congzhen Xie or Rui Wang.

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Competing interests

The authors declare no competing interests.

Peer review

Peer review information

Nature Communications thanks Guizhen Wang, Honghong Gong and Jinkai Yuan for their contribution to the peer review of this work. A peer review file is available.

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Supplementary information

Supplementary Information (download PDF )

Description Of Additional Supplementary File (download PDF )

Supplementary Data 1 (download ZIP )

Reporting summary (download PDF )

Transparent Peer Review file (download PDF )

Source data

Source Data (download XLSX )

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Open Access This article is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License, which permits any non-commercial use, sharing, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if you modified the licensed material. You do not have permission under this licence to share adapted material derived from this article or parts of it. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by-nc-nd/4.0/.

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Cite this article

Zhang, D., Wang, Q., Xie, C. et al. Potential well engineering for self-adaptive dielectric response polymer dielectrics. Nat Commun (2026). https://doi.org/10.1038/s41467-026-71184-7

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  • Received: 07 November 2025

  • Accepted: 16 March 2026

  • Published: 26 March 2026

  • DOI: https://doi.org/10.1038/s41467-026-71184-7

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