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Thermal Force Imaging of Hot Electrons in Operando Nanodevices
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  • Published: 09 April 2026

Thermal Force Imaging of Hot Electrons in Operando Nanodevices

  • Weikang Lu1,2,3,
  • Ziyi Xu1,2,3,
  • Hewan Zhang1,
  • Svend Age Biehs4,
  • Achim Kittel4,
  • Ludi Qin1,2,
  • Xue Gong1,2,
  • Huanyi Xue1,2,
  • Yanru Song  ORCID: orcid.org/0009-0004-8105-244X5,
  • Zhengyang Zhong1,
  • Shiyou Chen  ORCID: orcid.org/0000-0002-4039-85496,
  • Kun Ding  ORCID: orcid.org/0000-0002-0185-22271,
  • Wei Lu  ORCID: orcid.org/0000-0001-9859-83943,7 &
  • …
  • Zhenghua An  ORCID: orcid.org/0000-0001-8664-61841,2,8,9,10 

Nature Communications , Article number:  (2026) Cite this article

We are providing an unedited version of this manuscript to give early access to its findings. Before final publication, the manuscript will undergo further editing. Please note there may be errors present which affect the content, and all legal disclaimers apply.

Subjects

  • Applied physics
  • Atomic force microscopy
  • Electronic devices

Abstract

The relentless pursuit of smaller, faster nanoelectronics concentrates intense heat at nanometer scales, threatening performance and reliability. Yet directly mapping this heat from nonequilibrium hot electrons has remained elusive. Here we introduce the non-contact force technique that directly images hot-electron temperature distributions in operando devices. Using a bimodal atomic force microscope with sideband modulation, we harness frequency mixing to greatly boost sensitivity to hot-electron forces while suppressing parasitic electrostatic signals. This enables a thermal force microscope that visualizes hot electrons in the nanoconstriction of a silicon channel. Quantitative analysis reveals that thermal-fluctuation-induced force from hot electrons (\(\Delta {T}_{e} \sim 700\,{{{\rm{K}}}}\)) significantly exceed indirect effects from lattice heating (\(\Delta {T}_{L} \sim 3\,{{{\rm{K}}}}\)) or permittivity changes. At a 5 nm tip–sample gap, this pressure reaches ~3 bar, sufficient to drive substantial electro-thermo-mechanical effects. These results open a powerful route to probing hot-electron dynamics in working nanodevices and inform electro–thermal co-design strategies for post-Moore nanoelectronics.

Data availability

Source data underlying the main figures are provided as Supplementary Data accompanying this article. Additional data supporting the findings of this study are available from the corresponding author without restriction. Source data are provided with this paper.

Code availability

The code used for calculating force and the Hamaker function of this study is available from the corresponding authors upon request.

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Acknowledgements

Z.A. acknowledges the financial support from the National Key Research and Development Program of China (Grant No. 2024YFA1409800), Innovation Program for Quantum Science and Technology (Grant No. 2024ZD0300103), and the National Natural Science Foundation of China under Grant Nos. 11991060/12027805/12474042, Shanghai Science and Technology Committee under Grant No. 23DZ2260100, and the Sino-German Center for Research Promotion (No. M-0174). Y.S. acknowledges the financial support from the National Natural Science Foundation of China (NSFC) (Nos. 12403096), the Explorers Program of Shanghai (Basic Research Funding) (No. 24TS1400800). W.K.L. acknowledges the technological help from Molecular Vista Inc. Part of the experimental work was conducted in the Fudan Nanofabrication Lab.

Author information

Authors and Affiliations

  1. State Key Laboratory of Surface Physics, Department of Physics, Fudan University, Shanghai, China

    Weikang Lu, Ziyi Xu, Hewan Zhang, Ludi Qin, Xue Gong, Huanyi Xue, Zhengyang Zhong, Kun Ding & Zhenghua An

  2. Institute for Nanoelectronic Devices and Quantum Computing, Fudan University, Shanghai, China

    Weikang Lu, Ziyi Xu, Ludi Qin, Xue Gong, Huanyi Xue & Zhenghua An

  3. School of Physical Science and Technology, ShanghaiTech University, Shanghai, China

    Weikang Lu, Ziyi Xu & Wei Lu

  4. Institut für Physik, Carl von Ossietzky Universität, Oldenburg, Germany

    Svend Age Biehs & Achim Kittel

  5. ShanghaiTech Material and Device Lab (SMDL), ShanghaiTech University, Shanghai, China

    Yanru Song

  6. State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China

    Shiyou Chen

  7. State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China

    Wei Lu

  8. Shanghai Branch, Hefei National Laboratory, Shanghai, China

    Zhenghua An

  9. Shanghai Key Laboratory of Metasurfaces for Light Manipulation, Shanghai, China

    Zhenghua An

  10. Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China

    Zhenghua An

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Contributions

Z.A. and W.K.L. conceived the idea and designed the experiments. W.K.L. carried out all experiments with help from Z.X., L.Q., X.G., H.X., H.Z., S.A.B., A.K., K.D., and S.C. contributed to the theoretical analysis. Y.S. assisted with sample fabrication, and Z.Z. provided the wafer growth. Z.A. and W.K.L co-wrote the paper with comments from all authors. Z.A. and W.L. co-supervised the research project.

Corresponding authors

Correspondence to Wei Lu or Zhenghua An.

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Lu, W., Xu, Z., Zhang, H. et al. Thermal Force Imaging of Hot Electrons in Operando Nanodevices. Nat Commun (2026). https://doi.org/10.1038/s41467-026-71712-5

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  • Received: 15 September 2025

  • Accepted: 27 March 2026

  • Published: 09 April 2026

  • DOI: https://doi.org/10.1038/s41467-026-71712-5

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