Fig. 10: Comparison of other major properties of novel solder alloys Si-4 and Se-5 with commercial solder Sn90.88Ag3.8Cu0.7Ni0.12Sb1.5Bi3.0, besides the intrinsic strength and elongation of the solder alloys. | npj Computational Materials

Fig. 10: Comparison of other major properties of novel solder alloys Si-4 and Se-5 with commercial solder Sn90.88Ag3.8Cu0.7Ni0.12Sb1.5Bi3.0, besides the intrinsic strength and elongation of the solder alloys.

From: Discovering novel lead-free solder alloy by multi-objective Bayesian active learning with experimental uncertainty

Fig. 10

a–c DTA curves, d melting properties, g–i wettability (contact angle), and e electrical conductivity of solder alloys, and f shear strength of solder joints.

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