Fig. 7: TEM analysis on the microstructure and composition of the interphase between Cu and Ti3AlC2 in Cu-15 vol.%Ti3AlC2 composite.
From: Ultrasonic-assisted hot-press sintering of Cu-Ti₃AlC₂ composites
a Bright field TEM image of the interphase between Cu and Ti₃AlC₂ in Cu-15 vol.% Ti₃AlC₂ composite. b Magnified view of the area within the red dashed line in (a). EDS line scan across the interphase region between Cu and Ti₃AlC₂. Different line types denote the boundaries of regions with distinct contrasts. c Line scan result of (b), with the scan path marked by a red solid line in (b). d The SAED patterns from the region within the red dashed line in (a). Different grains are annotated with different geometric markers.
