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Since the early 1970s, the integrated circuit (IC) industry has witnessed profound progress in transistor dimension shrinkage through advancement in lithography technologies. After the 2010s, complementary metal-oxide–semiconductor (CMOS) devices have become the dominant technology in the semiconductor industry. Continuous enhancements in power, performance and area efficiency have been the core driver of progress in CMOS-based ICs. The cover image shows a perspective drawing of a clean room in a semiconductor fabrication facility. See W.-Y. Woon et al.
This thematic issue highlights research outside the traditional university, where research is driven by practical challenges, real-world products and applications, and economic priorities.
Optical wavefront shaping compensates distortions caused by scattering, aberrations or inhomogeneities in optical medium, enabling precise phase control to enhance light penetration in turbid environments. The integrated phase measurement sensor combines light sensing and modulation at pixel level within a single device, thereby reducing alignment constraints and bandwidth limitations.
Designing marketable 6G measurement tools presents technical and logistical challenges, including generating and capturing signals in new spectrum allocations with high speed and low latency, managing wide bandwidths, and ensuring system-level synchronization. Overcoming these challenges requires advances in hardware design and implementation of instrumentation tools tailored for 6G test environments.
A study in Nature Machine Intelligence presents a foundation model that uses multi-modal images and progressive pretraining to enhance generalizability across diverse Earth observation tasks.
In this Viewpoint, five professors at Korea Advanced Institute of Science and Technology (KAIST) discuss how this university, with world-class faculty, state-of-the-art research infrastructure and strong partnerships with global industry leaders, drives innovation across the entire semiconductor ecosystem — shaping the future of semiconductors in South Korea and beyond.
The shrinking dimensions, the increased structural complexity and the 3D stacking of silicon-based semiconductor devices are intensifying challenges in thermal dissipation. This Review explores thermal management materials, integration challenges and characterization methods, and proposes a road map for efficient heat dissipation solutions in 3D integration.
This Perspective sets out an approach to electron transport in nanoscale devices based on statistical fields — specifically the spatial and temporal variations in temperature and chemical potential that drive energy and particle flow — and highlights the importance of identifying the transport regime, which might be diffusive, ballistic or viscous.
Analogue in-memory computing (AIMC), with digital processing, forms a useful architecture for performant end-to-end execution of deep neural network models, but requires the development of sophisticated software stacks. This Perspective outlines the challenges in designing deep learning software stacks for AIMC-based accelerators, and suggests directions for future research.
Microdisplays for the glasses and headsets used in augmented reality and virtual reality must provide high pixel density, brightness and contrast, and fast response times. This Perspective explores three advanced technologies — liquid crystal on silicon, organic light-emitting diodes on silicon, and light-emitting diodes on silicon — that can meet the challenge.