Highly-Effective Thermoelectric Cooling for Power Semiconductor Devices Packed with Thermal-Expansion Offset and Flame Retardancy Epoxy Resin

Journal:
Advanced Functional Materials
Published:
DOI:
10.1002/adfm.202420944
Affiliations:
1
Authors:
10
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Institutions Authors Share
State Key Laboratory of Material Processing and Die and Mould Technology, HUST, China
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