In-Chip Mechanical Reliability Characterization and Modeling of CMOS-Based Memristor for 3D Integration

Journal:
Advanced Functional Materials
Published:
DOI:
10.1002/adfm.202523251
Affiliations:
3
Authors:
12
Go to article
Institutions Authors Share
State Key Laboratory of Integrated Chip and System, Fudan University, China
8.000000
 0.67
Peng Cheng Laboratory (PCL), China
3.000000
 0.25
Zhejiang Laboratory, China
1.000000
 0.08
Interested in Nanotechnology?