Hydrogen‐Bond Assembly Energetic Films with Ultra‐Flexibility and Reactivity for Advanced Transient Microchips

Journal:

Advanced Functional Materials

Published:

2025-12-09

DOI:

10.1002/adfm.202525672

Affiliations:

4

Authors:

9

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Institutions	Authors	Share
Beijing Institute of Technology (BIT), China	3.000000	0.33
Nanjing University of Science and Technology (NUST), China	2.000000	0.22
Institute of Chemical Materials (ICM), CAEP, China	2.000000	0.22
Southwest University of Science and Technology (SWUST), China	2.000000	0.22

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