Interfacial Hydrogen Bond Engineering: Enabling Rapid 3D Assembly of MXene Thick Electrodes with High Mass Loading and Fast Charge Transport
- Journal:
- Advanced Functional Materials
- Published:
- DOI:
- 10.1002/adfm.202526006
- Affiliations:
- 3
- Authors:
- 6
| Institutions | Authors | Share |
|---|---|---|
| University of Science and Technology of China (USTC), China | 0.50 | |
| Anhui University (AHU), China | 0.33 | |
| Huaibei Normal University, China | 0.17 |