Activity-Tunable Ultrasmall Ceria Abrasive for Ultra-Precision Chemical Mechanical Polishing of Semiconductor Dielectric Layers

Journal:

Advanced Functional Materials

Published:

2025-12-07

DOI:

10.1002/adfm.202528625

Affiliations:

5

Authors:

8

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Institutions	Authors	Share
Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials, Fudan University, China	2.000000	0.25
State Key Laboratory of Molecular Engineering of Polymers, Fudan University, China	2.000000	0.25
Inner Mongolia University, China	2.000000	0.25
Fudan University, China	1.000000	0.13
Hebei University of Technology (HEBUT), China	1.000000	0.13

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