Atomic Bridge-Bond Engineering for Interfacial Thermal Transport Optimizing in Borophene Lateral Heterostructures

Journal:
Advanced Functional Materials
Published:
DOI:
10.1002/adfm.202531954
Affiliations:
2
Authors:
6
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Institutions Authors Share
Chongqing University of Posts and Telecommunications (CQUPT), China
4.500000
 0.75
MOE Key Laboratory of Advanced Micro-Structured Materials, Tongji University, China
1.500000
 0.25
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