A Phase-Change-Enabled Thermal Interface Material With the Competitive Thermal Resistance of 0.03°C·cm2·W−1 for Electronic Devices Thermal Management in AI Era

Journal:

Advanced Functional Materials

Published:

2026-05-14

DOI:

10.1002/adfm.202600063

Affiliations:

5

Authors:

7

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Institutions	Authors	Share
State Key Laboratory of Materials for Integrated Circuits, SIMIT CAS, China	2.666667	0.38
Shenzhen Institutes of Advanced Technology (SIAT), CAS, China	2.666667	0.38
The Chinese University of Hong Kong (CUHK), China	1.000000	0.14
Southern University of Science and Technology (SUSTech), China	0.333333	0.05
Northeastern University (NEU), China	0.333333	0.05

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