Exceptional Thermal Conductivity in Printed Dielectrics through Compositional and Microstructural Design

Journal:
Advanced Materials
Published:
DOI:
10.1002/adma.202418984
Affiliations:
2
Authors:
7
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Institutions Authors Share
Northeastern University (NEU), China
4.000000
 0.57
U.S. Army DEVCOM Army Research Laboratory (ARL), United States of America (USA)
3.000000
 0.43
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