Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

Journal:

Advanced Materials

Published:

2025-10-03

DOI:

10.1002/adma.202507939

Affiliations:

7

Authors:

12

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Institutions	Authors	Share
The University of Osaka (UOsaka), Japan	5.000000	0.42
Osaka Institute of Technology (OIT), Japan	3.000000	0.25
Institute of Materials Structure Science (IMSS), KEK, Japan	2.000000	0.17
Institute for Integrated Radiation and Nuclear Science, Kyoto University, Japan	1.000000	0.08
Mie University, Japan	1.000000	0.08

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