Unlocking the Essence of Lignin: High‐Performance Adhesives That Bond via Thiol‐Catechol Connectivities and Debond on Electrochemical Command

Journal:
Advanced Materials
Published:
DOI:
10.1002/adma.202510463
Affiliations:
4
Authors:
8
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Institutions Authors Share
Humboldt University of Berlin (HU Berlin), Germany
6.500000
 0.81
Federal Institute for Materials Research and Testing (BAM), Germany
1.000000
 0.13
Friedrich Schiller University Jena (FSU), Germany
0.500000
 0.06
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