Cold, Rapid, and Scalable Stamping of Aramid‐Networked Viscoelastic h‐BN Doughs for Complex Thermal Architectures

Journal:

Advanced Materials

Published:

2026-02-05

DOI:

10.1002/adma.202512454

Affiliations:

5

Authors:

5

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Institutions	Authors	Share
Hanyang University (HYU), South Korea	3.500000	0.70
Korea Institute of Industrial Technology (KITECH), South Korea	0.500000	0.10
Korea Institute of Science and Technology (KIST), South Korea	0.500000	0.10
Department of JBNU-KIST Industry-Academia Convergence Research, South Korea	0.500000	0.10

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