Bond‐Mode Engineering in Copper(I) Halides: From Excitation‐Dependent Luminescence to High‐Resolution X‐Ray Imaging Screens

Journal:

Advanced Materials

Published:

2026-02-04

DOI:

10.1002/adma.202520967

Affiliations:

5

Authors:

9

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Institutions	Authors	Share
Beijing Key Laboratory of Microstructure and Property of Advanced Materials, BJUT, China	5.000000	0.56
Southeast University (SEU), China	1.000000	0.11
Hubei Provincial Key Laboratory of Low Dimensional Optoelectronic Materials and Devices, China	1.000000	0.11
Beijing University of Technology (BJUT), China	1.000000	0.11
Nankai University (NKU), China	1.000000	0.11

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