Tuning Cu–Cu Spacing in Single-Atomic Layer Cu Catalysts for Efficient and Stable CO2-To-C2H4 Electroreduction

Journal:

Advanced Materials

Published:

2026-01-21

DOI:

10.1002/adma.202522842

Affiliations:

5

Authors:

7

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Institutions	Authors	Share
Jiangxi Normal University (JXNU), China	5.000000	0.71
The University of Western Australia (UWA), Australia	1.000000	0.14
State Key Laboratory of Semiconductor Physics and Chip Technologies, IOS CAS, China	0.500000	0.07
University of Chinese Academy of Sciences (UCAS), China	0.500000	0.07

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