Reliable Vapor-Deposited Tin Perovskites for High-Performance and Low-Power Complementary Electronics

Journal:

Advanced Materials

Published:

2026-03-19

DOI:

10.1002/adma.72842

Affiliations:

4

Authors:

11

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Institutions	Authors	Share
State Key Laboratory of Electronic Thin Films and Integrated Devices, UESTC, China	6.000000	0.55
University of Electronic Science and Technology of China (UESTC), China	3.000000	0.27
Pohang University of Science and Technology (POSTECH), South Korea	2.000000	0.18

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