Quantitative Single-Particle Analysis: Plasmon Damping Modulation via Interfacial Engineering in Metal–Semiconductor Matchstick Heterostructures

Journal:: Analytical Chemistry
Published:: 2026-05-13
DOI:: 10.1021/acs.analchem.6c00492
Affiliations:: 1
Authors:: 3

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Institutions	Authors	Share
University of Ulsan (UOU), South Korea	3.000000	1.00

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