Low Contact Thermal Resistance without Packaging Pressure in Highly Thermally Conductive Interface Materials Enabled by Polysulfide Vitrimer

Journal:

Nano Letters

Published:

2025-12-17

DOI:

10.1021/acs.nanolett.5c04315

Affiliations:

5

Authors:

7

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Institutions	Authors	Share
State Key Laboratory of Organic-Inorganic Composites, BUCT, China	5.333333	0.76
Beijing Forestry University (BFU), China	0.500000	0.07
Beijing University of Chemical Technology (BUCT), China	0.500000	0.07
GRIPM Advanced Materials Research Institute, China	0.333333	0.05
GRINM NEXUSX Advanced Materials, China	0.333333	0.05

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