Interfacial Engineering toward Ultralow Thermal Boundary Resistance at Metal–Semiconductor Contacts

Journal:

Nano Letters

Published:

2026-02-03

DOI:

10.1021/acs.nanolett.5c05501

Affiliations:

5

Authors:

9

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Institutions	Authors	Share
Fudan University, China	5.000000	0.56
State Key Laboratory of Optoelectronic Materials and Technologies (OEMT), SYSU, China	2.000000	0.22
Research Center for Electronic and Optical Materials, NIMS, Japan	1.000000	0.11
State Key Laboratory for Artificial Microstructure and Mesoscopic Physics, PKU, China	1.000000	0.11

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