Etchant-Free Wafer-Scale 2D Transfer and van der Waals 3D Integration via Peel-Off Force Engineering

Journal:
ACS Nano
Published:
DOI:
10.1021/acsnano.5c04785
Affiliations:
6
Authors:
15
Go to article
Institutions Authors Share
Hongik University, South Korea
6.000000
 0.40
Sungkyunkwan University (SKKU), South Korea
4.000000
 0.27
Dongguk University, South Korea
2.000000
 0.13
Kookmin University, South Korea
2.000000
 0.13
Korea Advanced Nano Fab Center (KANC), South Korea
1.000000
 0.07
Interested in Nanotechnology?