In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density

Journal:
ACS Nano
Published:
DOI:
10.1021/acsnano.5c07534
Affiliations:
3
Authors:
10
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Institutions Authors Share
National Yang Ming Chiao Tung University (NYCU), Taiwan
8.000000
 0.80
Industrial Technology Research Institute (ITRI), Taiwan
2.000000
 0.20
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