Efficient thermal management of electronic devices by constructing interlayer phonon bridges

Journal:

Nature Communications

Published:

2025-11-26

DOI:

10.1038/s41467-025-65554-w

Affiliations:

4

Authors:

10

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Institutions	Authors	Share
State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, China	8.000000	0.80
State Key Laboratory of New Textile Materials and Advanced Processing, China	0.833333	0.08
Tongji Hospital (TJH), HUST, China	0.833333	0.08
Central China Normal University (CCNU), China	0.333333	0.03

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