Wafer-scale integration of single nanodiamonds via electrostatic-trapping

Journal:
Nature Communications
Published:
DOI:
10.1038/s41467-026-69590-y
Affiliations:
7
Authors:
12
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Institutions Authors Share
The University of Hong Kong (HKU), China
7.000000
 0.58
Southern University of Science and Technology (SUSTech), China
4.000000
 0.33
Korea Advanced Institute of Science and Technology (KAIST), South Korea
1.000000
 0.08
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