Turing-patterned TaS enables sub-2 nm diffusion barrier for advanced Cu interconnects

Journal:: Nature Communications
Published:: 2026-04-08
DOI:: 10.1038/s41467-026-71545-2
Affiliations:: 4
Authors:: 16

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Institutions	Authors	Share
Peking University (PKU), China	14.666667 14.666667	0.92
Beijing Advanced Innovation Center for Integrated Circuits, China	1.333333	0.08

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