A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Journal:

Applied Physics Letters

Published:

2025-06-16

DOI:

10.1063/5.0263946

Affiliations:

5

Authors:

21

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Institutions	Authors	Share
Beijing National Laboratory for Condensed Matter Physics, IOP CAS, China	10.833333 10.833333	0.52
University of Chinese Academy of Sciences (UCAS), China	6.333333	0.30
Hefei National Laboratory for Physical Sciences at the Microscale (HFNL), USTC, China	3.166667	0.15
CAS Songshan Lake Materials Laboratory, China	0.333333	0.02
Institute of Physics (IOP), CAS, China	0.333333	0.02

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