Graphene-based thermal interface materials with high through-plane thermal conductivity inspired by Baumkuchen

Journal:

Applied Physics Letters

Published:

2026-03-09

DOI:

10.1063/5.0310419

Affiliations:

4

Authors:

8

Go to article

Institutions	Authors	Share
Sino-Sweden Microsystem Integration Technology (SMIT) Center, China	5.000000	0.63
Shanghai Ruixi New Materials High Tech Co., Ltd., China	1.000000	0.13
Smart High Tech (SHT), Sweden	1.000000	0.13
Chalmers University of Technology (Chalmers), Sweden	1.000000	0.13

Interested in Materials Engineering?