Extracting deeply buried thermal resistance in Au/Au-bonded thick Si-on-diamond

Journal:

Applied Physics Letters

Published:

2026-02-23

DOI:

10.1063/5.0314427

Affiliations:

6

Authors:

13

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Institutions	Authors	Share
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, HIT, China	4.500000	0.35
Harbin Institute of Technology (HIT), China	4.500000	0.35
Nanjing Normal University (NNU), China	2.000000	0.15
China Electronics Technology Group Corporation (CETC), China	1.000000	0.08
Henan Core-diamond Material Technology, China	0.500000	0.04
Shanxi University (SXU), China	0.500000	0.04

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