Thermal interface material of carbon fiber enhanced micro-nano Cu sintering for power module thermal management

Journal:
Applied Physics Letters
Published:
DOI:
10.1063/5.0320544
Affiliations:
2
Authors:
3
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Institutions Authors Share
Huazhong University of Science and Technology (HUST), China
2.000000
 0.67
School of Materials Science and Engineering, HUST, China
1.000000
 0.33
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