High thermal conductivity diamond/SiC fibers/EP insulant composites with low permittivity prepared at different temperatures

Journal:

Applied Physics Letters

Published:

2026-04-06

DOI:

10.1063/5.0324618

Affiliations:

2

Authors:

7

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Institutions	Authors	Share
Southwest University of Science and Technology (SWUST), China	5.500000	0.79
University of Electronic Science and Technology of China (UESTC), China	1.500000	0.21

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