An overbend strategy to manyfold enhance the designed elastic bendability of flexible electronics

Journal:
Science Advances
Published:
DOI:
10.1126/sciadv.adv6631
Affiliations:
3
Authors:
5
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Institutions Authors Share
Institute of Mechanics (IM), CAS, China
2.500000
 0.50
University of Chinese Academy of Sciences (UCAS), China
2.000000
 0.40
Eindhoven University of Technology (TU/e), Netherlands
0.500000
 0.10
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