Rational assembly of 3D network materials and electronics through tensile buckling

Journal:

Science Advances

Published:

2025-09-12

DOI:

10.1126/sciadv.adz0718

Affiliations:

3

Authors:

11

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Institutions	Authors	Share
Tsinghua University, China	10.166667 10.166667	0.92
State Key Laboratory of Flexible Electronics Technology, Tsinghua, China	0.833333	0.08

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