Optical Interconnects for High-Performance Computing Systems
Summary
Optical interconnects employ light to transmit data between components of high-performance computing (HPC) systems, offering orders of magnitude greater bandwidth and lower latency than conventional electrical links. By integrating photonic devices onto silicon substrates, researchers have created compact, energy-efficient modules capable of handling multiterabit per second data flows. Key enabling technologies include photonic integrated circuits that combine lasers, modulators and detectors on a single chip, as well as wavelength-division multiplexing to multiply channel capacity. At the board and backplane level, novel optical fibres, waveguides and couplers reduce insertion loss and crosstalk, while on-chip photonic networks promise to overcome the bandwidth bottleneck among multicore processors. Advances in optical switching and mesh-based photonic network-on-chip architectures are addressing scalability and fault tolerance, and emerging modulators based on plasmonics or microresonators are pushing speed and energy-efficiency to new limits. Challenges remain in thermal management, packaging and integration with existing electronic control layers, but progress in hybrid electronic-photonic design is driving optical interconnects towards practical deployment in data centres, supercomputers and specialised AI accelerators worldwide.
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Recent work has demonstrated ultra-low-crosstalk silicon Mach-Zehnder interferometer switches driven both thermally and electrically, achieving crosstalk suppression below –40 dB and switching times down to 100 ns. These devices leverage self-heating effects to balance phase shifts in each arm, minimising insertion loss and enabling high-fidelity 50 Gb/s signal transmission with on-chip losses under 10 dB. In parallel, a comprehensive roadmap of optical communications has highlighted the maturation of integrated photonic technology for datacentre and HPC backplanes, identifying trends in heterogeneous integration, co-packaged optics with electronic switches and the convergence of coherent optics with silicon photonics to meet the ever-growing demand for bandwidth and energy efficiency. At the on-chip scale, pioneering hybrid optical-electronic network-on-chip architectures have been proposed that combine an electronic mesh for short-distance traffic with bus-based optical channels for long-distance links. These systems employ dynamic power management to switch optical channels on and off in response to load, yielding energy-efficiency gains of up to 47 % compared with purely electronic networks and offering a pathway towards scalable, many-core processor interconnects.
Optical Interconnects for High-Performance Computing Systems publication trend
The graph below shows the total number of articles in optical interconnects for high-performance computing systems across all publications each year (not limited to Nature Index journals).
Technical terms
Optical interconnect: Data-transmission link using light rather than electrical signals, providing high bandwidth and low latency.
Silicon photonics: Integration of optical devices (lasers, modulators, detectors) on silicon wafers for mass-manufacturable photonic circuits.
Photonic network-on-chip: On-chip communication fabric that uses photonic links instead of metal wires to connect processor cores.
Mach-Zehnder Interferometer: Optical structure that splits and recombines light paths to control phase and amplitude for switching or modulation.
Crosstalk: Unwanted coupling of signals between adjacent channels or waveguides that degrades signal integrity.
References
- Ultra-low-crosstalk silicon switches driven thermally and electrically. Microsystems & Nanoengineering (2025).
- Roadmap of optical communications. Journal of Optics (2016).
- Energy-efficient Hybrid Optical-Electronic Network-on-Chip for Future Many-core Processors. Elektronika ir Elektrotechnika (2014).
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