Intrinsically soft electronics marry high-conductivity metallic nanomaterials and liquid metals with elastomeric/hydrogel matrices to deliver stretchable, durable, and biocompatible devices. This review synthesizes design principles from percolation-guided nanocomposites (0D/1D/2D fillers), liquid-metal patterning, and unconventional fabrication (printing, soft/photolithography, laser) to overcome fatigue and resolution limits of geometry-engineered rigid systems. We highlight applications spanning low-impedance electrodes and sensors, strain-invariant interconnects and circuits, optoelectronics, wireless components, energy storage/harvesting, and stretchable memory. Remaining challenges—long-term stability, scalable manufacturing, and safe biointegration—are outlined with prospects for closed-loop, AI-enabled systems and fully integrated soft platforms.
- Sung-Hyuk Sunwoo
- Hye Jin Kim
- Dae-Hyeong Kim