2D semiconductors hold promise for the fabrication of high-density flexible integrated circuits, but they often require high-temperature processing or transfer steps. Here, the authors report the low-temperature ( ≤ 150 °C) fabrication of wafer-scale 3Dintegrated flexible complementary circuits based on 2D semiconductor inks.
- Taoyu Zou
- Seongmin Heo
- Yong-Young Noh
